Complete suppression of boron transient-enhanced diffusion and oxidation-enhanced diffusion in silicon using localized substitutional carbon incorporation
Ms. Carroll et al., Complete suppression of boron transient-enhanced diffusion and oxidation-enhanced diffusion in silicon using localized substitutional carbon incorporation, APPL PHYS L, 73(25), 1998, pp. 3695-3697
In this letter, we show the ability, through introduction of a thin Si1-x-y
GexCy layer, to eliminate the enhancement of enhanced boron diffusion in si
licon due to an oxidizing surface or ion implant damage. This reduction of
diffusion is accomplished through a low-temperature-grown thin epitaxial Si
1-x-yGexCy layer which completely filters our excess interstitials introduc
ed by oxidation or ion implant damage. We also quantify the oxidation-enhan
ccd diffusion (OED) and transient-enhanced diffusion (TED) dependence on su
bstitutional carbon level, and further report both the observation of carbo
n TED and OED, and its dependence on carbon levels. (C) 1998 American Insti
tute of Physics. [S0003-6951(98)00651-2].