Complete suppression of boron transient-enhanced diffusion and oxidation-enhanced diffusion in silicon using localized substitutional carbon incorporation

Citation
Ms. Carroll et al., Complete suppression of boron transient-enhanced diffusion and oxidation-enhanced diffusion in silicon using localized substitutional carbon incorporation, APPL PHYS L, 73(25), 1998, pp. 3695-3697
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
73
Issue
25
Year of publication
1998
Pages
3695 - 3697
Database
ISI
SICI code
0003-6951(199812)73:25<3695:CSOBTD>2.0.ZU;2-4
Abstract
In this letter, we show the ability, through introduction of a thin Si1-x-y GexCy layer, to eliminate the enhancement of enhanced boron diffusion in si licon due to an oxidizing surface or ion implant damage. This reduction of diffusion is accomplished through a low-temperature-grown thin epitaxial Si 1-x-yGexCy layer which completely filters our excess interstitials introduc ed by oxidation or ion implant damage. We also quantify the oxidation-enhan ccd diffusion (OED) and transient-enhanced diffusion (TED) dependence on su bstitutional carbon level, and further report both the observation of carbo n TED and OED, and its dependence on carbon levels. (C) 1998 American Insti tute of Physics. [S0003-6951(98)00651-2].