Rj. Xie et al., Effects of chemical compositions of adhesive and joining processes on bondstrength of Si3N4/Si3N4 joints, CERAM INT, 25(2), 1999, pp. 101-105
Silicon nitride ceramics were pressurelessly joined using glass adhesives w
ith different alpha-Si3N4 powder additions at the temperatures ranging from
1450 to 1750 degrees C for 10-120 min. The bond strength of the joint decr
eased sharply with increasing alpha-Si3N4 content in the adhesive. An optim
um strength, 400 MPa, was obtained when joining was performed at 1650 degre
es C for 30 min. The results of the microstructural analysis showed that an
intimate and glass-filled bond was produced where thermal cracks were also
found clearly. (C) 1999 Elsevier Science Limited and Techna S.r.l. All rig
hts reserved.