Temperature-dependent electrical resistivity in a Set of YBa2Cu3O7-x/Ag com
posites, all prepared under an identical sintering schedule, is analyzed to
extract granularity information. The weak-link resistivity rho(wl) across
the grain boundaries and the percolation factor alpha arising due to curren
t frustration caused by misalignment of anisotropic grains and sample defec
ts such as voids and cracks are estimated from the residual resistivity rho
(0) and the temperature coefficient of resistivity d rho/dT. Variation of t
hese parameters with Ag vol.% quantifying the extent of granularity indicat
es that granularity in the composites decreases and their electrical charac
teristics tend to be identical to that of Ag-free YBa2Cu3O7-x single crysta
ls and epitaxial thin films as Ag vol.% approaches a value where onset of c
urrent percolation occurs through Ag channels. The increased alpha and decr
eased rho(wl) observed at higher Ag vol.% explains the larger grains in the
composites with narrow size distribution.