Fabrication of nanomechanical optical devices with aligned wafer bonding

This paper reports on a new method for making some types of integrated opti cal nanomechanical devices. Intensity modulators as well as phase modulator s were fabricated using several silicon micromachining techniques, includin g chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhanc es their performance.