Pattern formation during delamination and buckling of thin films

Using a-simple lattice model, we study the failure of compressively straine d thin films on solid substrates. Our simulations reproduce much of the obs erved phenomenology of thin film blistering. In particular, we observe a pe culiar form of stress relief in which a wrinkle of delaminated film propaga tes along a sinusoidal path. At higher intrinsic strains, the sinusoidal wr inkles bifurcate, forming branches. Finally, we identify a high-strain regi me in which the film delaminates by forming a buckling front with many irre gular lobes. [S1063-651X(99)50603-X].