Starting with a brief review on the single-electron memory and its signific
ance among various single-electron devices, this paper addresses the key is
sues which one inevitably encounters when one tries to achieve giga-to-tera
bit memory integration. Among the issues discussed are: room-temperature o
peration; memory-cell architecture; sensing scheme; cell-design guideline;
use of nanocrystalline silicon versus lithography; array architecture ; dev
ice-to-device variations; read/write error rate; and CMOS/single-electron-m
emory hybrid integration and its positioning among various memory architect
ures.