An electrodeposition technique is described that produces atomically flat e
pitaxial metal overlayers of quality similar to that obtained by ultrahigh
vacuum techniques at elevated temperature. In this approach. a metal of int
erest such as silver is co-deposited with a reversibly deposited mediator m
etal. The mediator is periodically deposited and stripped from the surface,
and this serves to significantly increase the density of two-dimensional i
slands of silver atoms, promoting a layer-by-layer thin-film growth mode. I
n situ scanning tunneling microscopy was used to demonstrate the growth pro
cess for the heteroepitaxial system silver/gold (111) with either Lead or c
opper as the mediator.