THERMAL PERFORMANCE OF PIN-FIN FAN-SINK ASSEMBLIES

Citation
Ra. Wirtz et al., THERMAL PERFORMANCE OF PIN-FIN FAN-SINK ASSEMBLIES, Journal of electronic packaging, 119(1), 1997, pp. 26-31
Citations number
6
Categorie Soggetti
Engineering, Mechanical","Engineering, Eletrical & Electronic
ISSN journal
10437398
Volume
119
Issue
1
Year of publication
1997
Pages
26 - 31
Database
ISI
SICI code
1043-7398(1997)119:1<26:TPOPFA>2.0.ZU;2-6
Abstract
Experiments are reported on the thermal performance of model fan-sink assemblies consisting of a small axial flow San which impinges air on a square array of pin-fins. Cylindrical, square, and diamond shape cro ss section pin-fins are considered. The pin;fin heat transfer coeffici ent is found to be maximum immediately under the fan blades and minimu m below the fan hub and near the corners of the array. The overall hea t sink thermal resistance, R, decreases with an increase in either app lied pressure rise or fan power and fin height. At fixed applied press ure rise, R is minimized when the fin pitch-to-diameter ratio is maxim um. At fixed fan power, R is minimized when the pitch-to-diameter rati o is reduced toward unity. Finally, cylindrical pin-fins give the best overall fan-sink performance.