Forced flow of air overextended surfaces offers a simple, reliable, an
d effective heat removal mechanism and is often employed in electronic
equipment. The IBM 4381 heat sink, used in production IBM computers,
utilizes this cooling technique. This hear sink consists of a ceramic
substrate on which fins made of an aluminum-copper alloy are arranged
in a regular army. Cooling air enters the fin array from a nozzle. Ext
ensive experiments have been carried out to characterize the performan
ce of this heat sink at the Advanced Thermal Engineering Laboratory at
IBM Endicott. This paper presents computational analysis of the three
-dimensional flow and heat transfer in this device for two different a
ir flow rates through the nozzle. The heat dissipated by the electroni
c components is conducted into the fins through the ceramic base. Irt
the present study the ceramic base is assumed to be subjected to a uni
form heat flux at the bottom. The computational method incorporates a
special block-correction procedure to enable iterative solution of con
jugate heat transfer in the presence of large differences in thermal c
onductivities of the air and the fin material. The results of computat
ions reproduce the flow pattern in the fin array that is observed expe
rimentally. The part of the ceramic base directly below the nozzle is
well cooled with the temperatures gradually increasing from the center
towards the corner. The predicted pressure drop and most of the local
temperatures at the base and the tip of the fins agree well with the
experimental observations. This study illustrates the utility of compu
tational flow analysis in the analysis and design of electronic coolin
g techniques.