The directional solidification of highly undercooled single phase allo
y is put forward. In contrast with the conventional directional solidi
fication, it occurs under a negative temperature gradient at the solid
/liquid interface. The essential condition for this process is that th
e thermal diffusion in liquid plays a dominant role in the crystal gro
wth. An experiment on Cu-30at. %Ni alloy was conducted, and a directio
nal solidification structure consisting of a single crystal was obtain
ed in the undercooling range of 105-155 K.