STUDY OF THE PROCESS AND MECHANISM OF PLATING DIRECTLY ON TITANIUM AND ITS ALLOYS

Citation
Z. Yang et al., STUDY OF THE PROCESS AND MECHANISM OF PLATING DIRECTLY ON TITANIUM AND ITS ALLOYS, Plating and surface finishing, 84(12), 1997, pp. 68-71
Citations number
5
ISSN journal
03603164
Volume
84
Issue
12
Year of publication
1997
Pages
68 - 71
Database
ISI
SICI code
0360-3164(1997)84:12<68:SOTPAM>2.0.ZU;2-O
Abstract
A new process has been developed for forming an active film on the sur face of titanium and its alloys, which can then be electroplated, much like nickel, copper or chromium. The technology can assure the adhesi on of the electroplated coating, In addition, the paper discusses the mechanism of the ''active film''' formation.