We have detected voltages between ohmic electrodes on Si wafers when a
cleavage occurs at one of the contacts. Samples were measured at room
temperature (RT) in air and under liquid nitrogen. The detected signa
l are positive for p-type and negative for n-type samples. show a temp
oral decay profile consistent with cooling, and are consistent with cl
eavage heat generation causing a thermoelectric effect. The signals pe
ak after the system response time of 0.1 ms, are of average magnitude
59 mu V at RT, and at 78 K are 103 mu V, consistent with the increased
thermopower at low temperatures. The data, considering the large cool
ing by the bulk and metallic contact, indicate that significant elevat
ed temperatures occur at the cleavage surface. This can affect surface
structures and properties. (C) 1997 Elsevier Science B.V.