A. Munitz et al., THE IMPACT OF COOLING RATES ON THE MICROSTRUCTURE OF AL-U ALLOYS, Metallurgical and materials transactions. A, Physical metallurgy andmaterials science, 28(4), 1997, pp. 1035-1046
The impact of cooling rates on the microstructure of Al-U alloys was s
tudied by optical, scanning electron, and transmission electron micros
copy. A variety of solidification techniques were employed to obtain c
ooling rates ranging between 3 X 10(-2) and 10(6) K/s. High-purity ura
nium (99.9 pct) and high-purity aluminum (99.99 pct), or ''commerciall
y pure'' type Al-1050 aluminum alloys were used to prepare Al-U alloys
with U concentration ranging between 3 and 22 wt pct. The U concentra
tion at which a coupled eutectic growth was observed depends on the co
oling rates imposed during solidification and ranged from 13.8 wt pct
for the slower cooling rates to more than 22 wt pct for the fastest co
oling rates. The eutectic morphology and its distribution depends on t
he type of aluminum used in preparing the alloys and on the cooling ra
tes during solidification. The eutectic in alloys prepared from pure a
luminum was evenly distributed, while for those prepared from Al-1050,
the eutectic was unevenly distributed, with eutectic colonies of up t
o 3 mm in diameter. Two lamellar eutectic structures were observed in
alloys prepared from pure aluminum containing more than 18 wt pct U, w
hich solidified by cooling rates of about 10 K/s. One structure consis
ted of the stable eutectic between UAl4 and Al lamella. The other stru
cture consisted of a metastable eutectic between UAl4 and Al lamella.
At least three different eutectic morphologies were observed in alloys
prepared from Al-1050.