FLIP-CHIP PHOTODETECTOR FOR HIGH-SPEED COMMUNICATIONS INSTRUMENTATION

Citation
Ts. Tan et al., FLIP-CHIP PHOTODETECTOR FOR HIGH-SPEED COMMUNICATIONS INSTRUMENTATION, HEWLETT-PAC, 48(5), 1997, pp. 102-110
Citations number
3
Journal title
HEWLETT-PACKARD JOURNAL
ISSN journal
00181153 → ACNP
Volume
48
Issue
5
Year of publication
1997
Pages
102 - 110
Database
ISI
SICI code
0018-1153(1997)48:5<102:FPFHCI>2.0.ZU;2-6
Abstract
A family of 7-GHz-bandwidth optical receivers and a nine-channel optic al receiver with a gigabit-per-second data rare per channel have been developed for multigigabit lightwave test systems for long-haul fiber- optic telecommunications links and gigabit optical interconnects for c omputer systems. A new micro-flip-chip process, featuring liftoff-base d small-diameter solder bumps, is incorporated with HP high-speed InP p-i-n photodetectors to minimize parasitic capacitance and inductance and enhance responsivity.