In this paper, an outlook on future aspects of process simulation is g
iven. The main direction for ongoing research is simulation in three s
pace dimensions. For modern devices, all three spatial coordinates mus
t be obeyed in process simulation, to provide sufficiently accurate do
ping profiles and device geometry for three-dimensional device simulat
ion and, therefore, to predict the electric behaviour of the device re
alistically. Some new techniques to circumvent current limitations in
three-dimensional process simulations are depicted. Aspects of process
now representation for future automatic process optimization are disc
ussed.