We deposited CVD diamond films at substrate temperatures T-sub below 6
00 degrees C using halogen-containing precursor gases. CHF3 and C2H5Cl
made possible a significant decrease in T-sub down to 370 degrees C u
sing hot-filament CVD technique. At lower T-sub only amorph-graphitic
depositions could be obtained. The lowest substrate temperature for di
amond growth T-min depends on the deposition parameters. We find a dec
rease in this temperature with decreasing carbon content in the precur
sor gas or decreasing filament to substrate distance. These effects sh
ow the influence of both surface diffusion and concentration of radica
ls in the gas phase near the substrate.