NiFe/Cu/Co trilayers have been prepared on 4 degrees tilt-cut Si (111)
substrate by RF magnetron sputtering method. When a Cu(50 Angstrom) u
nderlayer was deposited prior to the formation of the trilayer, NiFe a
nd Co layers consisting of the trilayer developed in-plane magnetic an
isotropy where the easy axes were perpendicular to each other. This un
usual fact could be confirmed from the M-H curves and the correspondin
g R-H curves of the trilayers. When a small amount of Co was added to
NiFe layer to form a NiFeCo/Cu/Co trilayer, the easy axes of NiFeCo an
d Co layers turned out to be aligned along the same direction so that
perfectly square R-H curves could be obtained. In [NiFeCo(60 Angstrom)
/Cu(25 Angstrom)/Co(30 Angstrom)]/Cu(50 Angstrom)/Si(111, 4 degrees ti
lt-cut) samples, 5.5% of MR ratio was obtained at room temperature, an
d the maximum and minimum MR values could be obtained at zero external
magnetic field in the minor R-H curves. According to the R-H curves,
it has been believed that NiFe/Cu/Co trilayers on 4 degrees tilt-cut S
i (111) substrate are suitable for switching devices and NiFeCo/Cu/Co
trilayers for a memory application. (C) 1997 American Institute of Phy
sics.