ANISOTROPIC ETCHING OF SILICON-CRYSTALS IN KOH SOLUTION - PART III - EXPERIMENTAL AND THEORETICAL SHAPES FOR 3D STRUCTURES MICRO-MACHINED IN (HK0) PLATES
Cr. Tellier, ANISOTROPIC ETCHING OF SILICON-CRYSTALS IN KOH SOLUTION - PART III - EXPERIMENTAL AND THEORETICAL SHAPES FOR 3D STRUCTURES MICRO-MACHINED IN (HK0) PLATES, Journal of Materials Science, 33(1), 1998, pp. 117-131
The micro-machining of various (hk0) silicon plates in an aqueous KOH
solution was studied. Orientation effects, the formation of limiting f
acets and concave or convex undercuttings have been analysed for (hk0)
membranes and mesa obtained starting with circular masks. Procedures
have been derived to predict 3D etching shapes using a tensorial model
for the chemical etching. Predicted shapes for membranes have been fo
und to closely agree with experimental shapes because of the important
role played by limiting {111} facets. Theoretical general shapes for
etched mesa were also in crude accord with experiments. Consequently s
ome attempts have been made to identify limiting (hhl) planes which ca
n participate to convex undercutting and to discuss the role of the di
ssolution slowness surface.