PARTIAL TRANSIENT LIQUID-PHASE BONDING OF SI3N4 WITH TI CU/NI MULTI-INTERLAYERS/

Authors
ZHENG C LOU HQ FEI Z LI ZZ
Citation
C. Zheng et al., PARTIAL TRANSIENT LIQUID-PHASE BONDING OF SI3N4 WITH TI CU/NI MULTI-INTERLAYERS/, Journal of materials science letters, 16(24), 1997, pp. 2026-2028
Citations number
9
Journal title
Journal of materials science letters → ACNP
ISSN journal
02618028
Volume
16
Issue
24
Year of publication
1997
Pages
2026 - 2028
Database
ISI
SICI code
0261-8028(1997)16:24<2026:PTLBOS>2.0.ZU;2-7