R. Narasimhan et Sk. Biswas, A FINITE-ELEMENT STUDY OF THE INDENTATION MECHANICS OF AN ADHESIVELY BONDED LAYERED SOLID, International journal of mechanical sciences, 40(4), 1998, pp. 357-370
The objective of this work is to study the mechanics of indentation of
an adhesively bonded layered solid. To this end, several (plane strai
n) finite element simulations of wedge indentation of a ductile strip
which is adhesively bonded to a rigid substrate are conducted by varyi
ng the properties of the adhesive layer. The stress fields below the i
ndenter tip and at the strip-adhesive interface are examined for Vario
us depths of indentation. The effects of the adhesive properties on th
e above features of the finite element solution, as well as on the har
dness versus penetration characteristics, are investigated. The above
results are also compared with those for an unbonded strip resting on
a frictionless surface. It is found that once yielding commences in th
e adhesive layer, the state of stress in it is comprised of a shear st
ress and a superposed hydrostatic compression. Also, it is observed th
at increasing the yield strength of the adhesive layer significantly d
elays the onset of the decreasing phase of the hardness versus penetra
tion curve, whereas, changing the elastic modulus of the adhesive has
negligible effect on it. (C) 1997 Published by Elsevier Science Ltd.