M. Yamane et al., REASONS FOR HEAT-RESISTANCE AND REDUCED OXIDE THICKNESS OF TA2N ANODIZED CAPACITORS, Electronics & communications in Japan. Part 2, Electronics, 79(11), 1996, pp. 76-83
Ta2N anodized capacitors have much greater heat resistance than Ta ano
dized capacitors. The difference between the heat resistances of the T
a and Ta2N capacitors was investigated by Auger analysis and it was fo
und that the Ta2N compound thin film itself has a high heat resistance
: Very little thermal oxidation of this film occurs until relatively h
igh temperatures. The thermal degradation of TaN2 anodized capacitors
which takes place at temperatures above 450 degrees C was found to be
due to the oxygen diffusion from the anodized layer to the Ta2N underl
ayer, Another cause of thermal degradation was the oxidation of the Al
electrode at high temperatures. Therefore, both the breakdown of the
interface between the electrode and anodized layer and the oxidation o
f Al also contributed to the thermal degradation of the capacitors at
high temperature. Even though the thickness of the Ta2N anodized layer
was reduced by using a 30 V anodizing voltage, the heat resistance wa
s greater and the capacitance was 3 times as high as that of Ta capaci
tors anodized at 160 V.