Wh. Park et Jk. Lee, A STUDY ON ISOTHERMAL CURE BEHAVIOR OF AN EPOXY-RICH ANHYDRIDE SYSTEMBY DIFFERENTIAL SCANNING CALORIMETRY/, Journal of applied polymer science, 67(6), 1998, pp. 1101-1108
Cure behavior of a catalyzed epoxy/anhydride system was investigated f
or an epoxy-rich formulation using differential scanning calorimetry (
DSC). The mixture was isothermally cured at different times and temper
atures, and the cure behavior of the samples was analyzed by the peak
exothermic temperature (T-peak) and the extent of cure reaction (X) fr
om DSC thermograms. For the excess epoxy sample, two exothermic peaks
at a low temperature from esterification reaction and at a high temper
ature from etherification on DSC curves appeared in the early stage of
cure and shifted to a lower temperature scale with curing. However, t
he esterification peak disappeared and the remaining etherification pe
ak shifted to a higher temperature with further cure. The shift of the
peaks may be attributed to the change of reaction mechanism from kine
tically controlled to diffusion-controlled. The extent of cure of este
rification and etherification was also considered separately in this a
rticle. The result shows that esterification reaction mainly occurs in
the early stage of cure and then etherification slowly proceeds after
the completion of the esterification. (C) 1998 John Wiley & Sons, Inc
.