OPTIMAL USAGE OF AVAILABLE WIRING RESOURCES IN DIFFRACTIVE-REFLECTIVEOPTOELECTRONIC MULTICHIP MODULES

Advances in VLSI and optoelectronic multichip module technologies are enabling the construction of ultracompact massively parallel processin g systems. The technological parameters that define the wirability and delay characteristics of these technologies have a significant impact on the system architecture. An analytical model is presented that all ows the design space exploration of the interconnection networks assoc iated with multinode chips packaged on a single multichip module subst rate. Possible system designs are evaluated for a two-level interconne ct with separate k-ary n-cube networks for interchip and intrachip com munication. The impact of several architectural and technological para meters on the optimal network implementation (based on average no-load latency) is analyzed. (C) 1998 Optical Society of America.