The effect of phosphoric acid concentration and temperature on the for
mation and dissolution process of niobium oxide was investigated using
capacitance, potential and galvanostatic measurements. The formation
rate of the niobium oxide increases with increasing phosphoric acid co
ncentration and decreases with increasing temperature. The dissolution
rate of the niobium oxide is accelerated by increasing phosphoric aci
d concentration and temperature. The activation energy was calculated
for both the formation and dissolution process and found to be 8.93 an
d 16.65 kJ/mol respectively. The effect of formation voltage on the di
ssolution process of niobium oxide was also investigated. The oxide fi
lm formed at high-formation voltage has a more defective character tha
n that formed at lower voltage. This enhances the dissolution process
of the oxide. The effect of current density on the formation rate and
the thickness during the oxide film growth was measured. (C) 1997 Else
vier Science S.A.