LOW-TEMPERATURE DRY-ETCHING OF GAAS AND ALGAAS USING 92-MHZ ANODE-COUPLED CHLORINE REACTIVE ION ETCHING

Citation
T. Saitoh et al., LOW-TEMPERATURE DRY-ETCHING OF GAAS AND ALGAAS USING 92-MHZ ANODE-COUPLED CHLORINE REACTIVE ION ETCHING, JPN J A P 1, 36(12B), 1997, pp. 7650-7654
Citations number
10
Volume
36
Issue
12B
Year of publication
1997
Pages
7650 - 7654
Database
ISI
SICI code
Abstract
The etching characteristics and the damage induced by low-temperature etching have been studied using 92-MHz anode-coupled reactive ion etch ing. Due to the suppression of sidewall etching, vertical profiles of GaAs and AlGaAs have been obtained by lowering the substrate temperatu re during etching. The etching rates of GaAs and AlGaAs become identic al at low temperatures. The exciton peak intensity in the photolumines cence spectrum decreased with a decrease in etching temperature, sugge sting a slight increase in damage in low-temperature etching. It is al so found that pronounced stoichiometry change in the subsurface region takes place in low-temperature etching.