E. Rauhala et al., DEFECT FORMATION AND ANNEALING BEHAVIOR OF INP IMPLANTED BY LOW-ENERGY N-15 IONS, Journal of applied physics, 83(2), 1998, pp. 738-746
Defect formation has been studied in nitrogen-implanted III-V compound
semiconductor material InP. Sulphur-doped n-type (100) InP samples we
re implanted at room temperature with 30 keV N-15(+) ion doses of 10(1
4)-10(16) N atoms cm(-2). The implanted samples were subjected to isoc
hronal vacuum annealing in the temperature range of 450-650 degrees C.
The annealing behavior of nitrogen atom distributions, implantation-i
nduced displacements of indium atoms, vacancy-type defects, and damage
annealing were studied by nuclear resonance broadening, secondary ion
mass spectrometry, ion backscattering and channeling, and slow positr
on annihilation techniques. Doses above 10(15) N atoms cm(-2) were fou
nd to, produce amorphous layers extending from the surface to depths b
eyond the deposited energy distribution, up to 110 nm. The depth of an
amorphous layer was observed to depend on the implantation dose. Temp
erature and dose-dependent epitaxial regrowth starting from the amorph
ous-crystalline interface was observed at 575 degrees C. The damage an
d vacancy concentration distributions were correlated with the implant
ed nitrogen distribution in the case of the highest implantation dose
at 10(16) N atoms cm(-2); disorder annealing and loss of nitrogen beha
ve in a like manner with increasing temperature. For the lower doses,
however, almost no redistribution or loss of nitrogen arose despite st
ructural damage and vacancy annealing. Interpretation of the positron
data allowed an identification of two types of vacancies. The type of
the vacancy defects was found to depend on the implantation dose and a
nnealing temperature; monovacancies were formed in the In sublattice a
t the low implantation doses, while the highest dose produced divacanc
ies. The annealing tended to convert the monovacancies into divacancie
s, which were recovered at high temperatures depending on the implanta
tion dose. (C) 1998 American Institute of Physics. [S0021-8979(98)0740
2-7].