SHORT-CIRCUIT DIFFUSION IN NI-AL ALLOYS

Citation
J. Cermak et al., SHORT-CIRCUIT DIFFUSION IN NI-AL ALLOYS, Intermetallics, 6(1), 1998, pp. 21-28
Citations number
18
Categorie Soggetti
Metallurgy & Metallurigical Engineering","Chemistry Physical","Material Science
Journal title
ISSN journal
09669795
Volume
6
Issue
1
Year of publication
1998
Pages
21 - 28
Database
ISI
SICI code
0966-9795(1998)6:1<21:SDINA>2.0.ZU;2-B
Abstract
The tracer grain boundary diffusivity, P, of nickel in polycrystalline Ni-B, Ni-9 at% Al-B and in NiAl-B intermetallic has been measured wit h boron concentrations x(B) up to 0.3 at% B. The measurements were don e by the residual activity method in the temperature interval from 773 to 1073 K. It was observed that P decreases with growing concentratio n of boron in Ni-B and Ni-9 at% Al-B. This behaviour is similar to the dependence of P on x(B) in Ni3Al, reported in our previous paper. In boron-doped NiAl intermetallic, on the other hand, P does not depend o n x(B). (C) 1997 Elsevier Science Limited. All rights reserved.