ADHESION AND FRACTURE OF TANTALUM NITRIDE FILMS

Indentation fracture and continuous nanoscratch testing were used in t his study to determine the effects of compressive residual stresses on the fracture of thin sputter-deposited tantalum nitride films. Some f ilms were tested in the as-deposited condition while others were vacuu m annealed at 300 degrees C. The only discernible change in structure was a surface rearrangement of atoms into parallel arrays of striation s on the vacuum annealed samples revealing a high compressive residual stress state after deposition. Comparison of results and application of mechanics-based models showed that these stresses had a strong effe ct on the fracture of the as-deposited films. The models also provided a good measure of the residual stress levels and interfacial strain e nergy release rates. (C) 1998 Acta Metallurgica Inc.