THE IMPACT OF INTERFACIAL ADHESION AN PTH AND VIA STRESS STATE

Citation
G. Subbarayan et al., THE IMPACT OF INTERFACIAL ADHESION AN PTH AND VIA STRESS STATE, Journal of electronic packaging, 119(4), 1997, pp. 260-267
Citations number
28
ISSN journal
10437398
Volume
119
Issue
4
Year of publication
1997
Pages
260 - 267
Database
ISI
SICI code
1043-7398(1997)119:4<260:TIOIAA>2.0.ZU;2-C
Abstract
In this paper the impact of the state of barrel-laminate adhesion on t he PTH and via stresses is investigated. A representative PTH and a re presentative blind via in a printed wiring board are used as demonstra tion vehicles. Transient heat conduction and nonlinear elastic-plastic -contact finite element analyses are carried out on PTHs and vias unde r the extreme conditions of perfect and zero barrel-laminate adhesion. In general, the maximum equivalent plastic strains in PTHs and vias w ith strong barrel-laminate adhesion are not large enough to fracture t he plating. Fracture is possible at or near the innerplane junction wh en barrel-laminate adhesion is lost. The possibility of plating fractu re in a blind via is strongly dependent on the tolerances in manufactu ring process parameters such as drill depth and laminate thickness.