Solutions for axisymmetric profiles of solder joints formed between a
cyclindrical pin and a printed circuit board (PCB) are presented. The
dimensionless differential equation governing the formation of the sol
der joints is developed and then solved numerically for the cases of s
ingle upright joints, single inverted joints, and through-hole joints.
Results are presented in terms of the following dimensionless paramet
ers: bond number, solder volume, board thickness, and tinning radius.
The dimensionless approach makes the results from this study suitable
for use in a broader rang of applications.