PREDICTION OF SOLDER GEOMETRY FOR AN AXISYMMETRICAL THROUGH-HOLE JOINT

Solutions for axisymmetric profiles of solder joints formed between a cyclindrical pin and a printed circuit board (PCB) are presented. The dimensionless differential equation governing the formation of the sol der joints is developed and then solved numerically for the cases of s ingle upright joints, single inverted joints, and through-hole joints. Results are presented in terms of the following dimensionless paramet ers: bond number, solder volume, board thickness, and tinning radius. The dimensionless approach makes the results from this study suitable for use in a broader rang of applications.