RESIDUAL-STRESS ANALYSIS OF BIMATERIAL STRIPS UNDER MULTIPLE THERMAL LOADING

Citation
Jw. Tierney et Jw. Eischen, RESIDUAL-STRESS ANALYSIS OF BIMATERIAL STRIPS UNDER MULTIPLE THERMAL LOADING, Journal of electronic packaging, 119(4), 1997, pp. 281-287
Citations number
12
ISSN journal
10437398
Volume
119
Issue
4
Year of publication
1997
Pages
281 - 287
Database
ISI
SICI code
1043-7398(1997)119:4<281:RAOBSU>2.0.ZU;2-B
Abstract
The residual stress distribution in bimaterial beams induced by multip le thermal loadings has been investigated. Three models for the nonlin ear stress-strain material behavior were considered: bilinear elastic- plastic, power law elastic-plastic, and power law purely plastic. The equations governing equilibrium, compatibility of strain, and stress-s train for the bimaterial configuration make up a system of nonlinear a lgebraic equations which is solved numerically. The elastic-plastic po wer law model leads to stress discontinuity in the layers. The other t wo models have been verified with a finite element analysis. Several e xamples are included using materials common to the microelectronics in dustry.