Jw. Tierney et Jw. Eischen, RESIDUAL-STRESS ANALYSIS OF BIMATERIAL STRIPS UNDER MULTIPLE THERMAL LOADING, Journal of electronic packaging, 119(4), 1997, pp. 281-287
The residual stress distribution in bimaterial beams induced by multip
le thermal loadings has been investigated. Three models for the nonlin
ear stress-strain material behavior were considered: bilinear elastic-
plastic, power law elastic-plastic, and power law purely plastic. The
equations governing equilibrium, compatibility of strain, and stress-s
train for the bimaterial configuration make up a system of nonlinear a
lgebraic equations which is solved numerically. The elastic-plastic po
wer law model leads to stress discontinuity in the layers. The other t
wo models have been verified with a finite element analysis. Several e
xamples are included using materials common to the microelectronics in
dustry.