Reliable metallization schemes for chemical vapor deposited diamond ar
e critical for expanding the use of diamond components in electronics
and optics. We present here the results of our investigation of severa
l metallization schemes produced by cathodic are deposition. The depos
ition process also allows the control of the metal ion energy, and thi
s is used to promote good adhesion between film and substrate. Films o
f Mo, Cu, Ta and W with thickness varying between 50 and 1000 nm were
deposited on free-standing smooth diamond substrates and annealed at t
emperatures between 200 degrees C and 900 degrees C. Interdiffusion an
d solid state reactions between carbon and the deposited metal were st
udied using backscattering spectrometry and X-ray diffraction. Of the
films tested, W was the only one virtually unaffected by annealing at
all temperatures. Upon annealing at 200 degrees C all metal films rema
ined intact and did not delaminate. (C) 1997 Elsevier Science S.A.