Bw. Sheldon, SILICON-NITRIDE OXIDATION BASED ON OXYNITRIDE INTERLAYERS WITH GRADEDSTOICHIOMETRY, Journal of the American Ceramic Society, 79(11), 1996, pp. 2993-2996
The oxidation kinetics of Si3N4 were modeled by describing the simulta
neous diffusion and reaction of interstitial oxygen that is believed t
o occur inside of the silicon oxynitride interlayer, The oxynitride wa
s assumed to have a variable composition, and oxidation was described
as a reaction where interstitial oxygen is incorporated into the netwo
rk structure of the oxynitride and nitrogen is removed, It was assumed
that both the diffusion coefficient and the solubility of interstitia
l oxygen decrease as the nitrogen content of the network structure inc
reases. The results accurately describe both the formation of an oxyni
tride layer during oxidation, and the relatively slow oxidation kineti
cs of Si3N4 (compared to Si and SiC).