SURFACE-MOUNT BGA REDUCES MMIC PACKAGING COST

Authors
CHIN S
Citation
S. Chin, SURFACE-MOUNT BGA REDUCES MMIC PACKAGING COST, Electronic products, 40(8), 1998, pp. 21-22
Citations number
NO
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronic products → ACNP
ISSN journal
00134953
Volume
40
Issue
8
Year of publication
1998
Pages
21 - 22
Database
ISI
SICI code
0013-4953(1998)40:8<21:SBRMPC>2.0.ZU;2-B