ALTERNATIVE APPROACH TO ELECTROLESS CU METALLIZATION OF ALN BY A NONAQUEOUS POLYOL PROCESS

Cu metallization of AIN substrates was performed using a nonaqueous, e lectroless; alcohol based approach known as the polyol method. The con centration of Cu2O in the film depended on the orientation of the subs trates during deposition. This approach is very attractive for metalli zing electronic substrates which are susceptible to hydrolytic degrada tion. (C) 1997 American Institute of Physics.