FULL AUTO-MOLDING SYSTEM FAMS-C FOR THIN PLASTIC IC PACKAGES

Due to the increasing market demand for light-weight, high-performance ICs for portable information terminals, PHS (Personal Handy Phone Sys tem), electronic notebook, etc., the profiles of semiconductor package s for microprocessors and memories are being modified towards thinner body, fine-pitch, and higher pin-counts packages. Thinner packages req uire new technology to cope with various molding problems such as wire sway, cracking, voids, warpage, etc. This paper describes the feature s of the newly developed Compact Full Auto-Molding System (FAMS-C) esp ecially designed for molding thin plastic IC packages such as 1.4 mm t hickness LQFP (Low Profile Quad Flat Package) and 1 mm thickness TQFP (Thin Quad Flat Package) and TSOP (Thin Small Outline Package). An inn ovative pressurizing mechanism and injection mechanism have been devis ed by incorporating an electric servo motor instead of hydraulic oil c ylinder, to realize a flexible, clean, high-throughput and floor-space saving advanced IC package molding system.