Discharges in electronegative gases are routinely used for the sub-mic
ron etching of thin films in the microelectronics industry. Because of
the strong electronegative character of these gases, negative ions co
nstitute a significant fraction of the charged particles content of th
e discharge. The presence of these negative charge carriers affects th
e whole behavior of the discharge and in particular, its electron powe
r balance. This article compares a few characteristics of a high-densi
ty plasma produced either in SF6 or in Cl-2 with those of an argon pla
sma under similar experimental conditions. We show that the plasma pre
sents characteristics when the gas is electronegative that significant
ly differ from those observed in argon.