NUMERICAL AND EXPERIMENTAL INVESTIGATION OF MICROCHIP ENCAPSULATION

Citation
Amk. Reddy et al., NUMERICAL AND EXPERIMENTAL INVESTIGATION OF MICROCHIP ENCAPSULATION, Journal of reinforced plastics and composites, 17(1), 1998, pp. 70-93
Citations number
27
Categorie Soggetti
Materials Sciences, Composites","Polymer Sciences
ISSN journal
07316844
Volume
17
Issue
1
Year of publication
1998
Pages
70 - 93
Database
ISI
SICI code
0731-6844(1998)17:1<70:NAEIOM>2.0.ZU;2-T
Abstract
A numerical simulation of moving boundaries in a two-dimensional, iner tia-free, incompressible flow with shear-thinning viscosity is present ed. A control-volume approach with fixed finite-element mesh is used f or predicting the fluid-front advancement. The experimental results fo r nine different configurations of upper-and lower-cavity thickness in a flow domain similar to the mold cavity used for microchip encapsula tion are reported. The predicted fluid-front advancement and pressure are found to be in good agreement with the corresponding experimental measurements. The difference in pressure on two sides of the paddle is used to develop an analytical model for predicting the paddle shift d uring microchip encapsulation.