A NEW LEAD-TO-PAD ALIGNMENT TECHNIQUE FOR SURFACE-MOUNT COMPONENT PLACEMENT

Authors
CHERAGHI SH
Citation
Sh. Cheraghi, A NEW LEAD-TO-PAD ALIGNMENT TECHNIQUE FOR SURFACE-MOUNT COMPONENT PLACEMENT, International journal of computer integrated manufacturing, 11(2), 1998, pp. 95-102
Citations number
7
Categorie Soggetti
Computer Science Interdisciplinary Applications","Operatione Research & Management Science","Computer Science Interdisciplinary Applications","Engineering, Manufacturing","Operatione Research & Management Science
Journal title
International journal of computer integrated manufacturing → ACNP
ISSN journal
0951192X
Volume
11
Issue
2
Year of publication
1998
Pages
95 - 102
Database
ISI
SICI code
0951-192X(1998)11:2<95:ANLATF>2.0.ZU;2-N
Abstract
The criterion for an acceptable assembly of a surface-mounted printed circuit board is that leads of surface-mount components must have a mi nimum acceptable surface contact with their corresponding pads. The hi gher the minimum surface contact the more reliable the assembly. Most surface-mount component placement systems use a component-to-pad align ment technique for placement of surface-mount components, This alignme nt technique does not guarantee maximum lead-to-pad surface contact du e to errors in leads and pads. In this paper, a lead-to-pad alignment technique for placement of surface-mount components is presented.