PROPERTIES AND RELIABILITY OF LIQUID EPOXY-RESIN FOR LSI FABRICATION WITH THE PRINTING ENCAPSULATION SYSTEM (PES) (VOL 80, PG 67, 1997)

Citation
A. Okuno et al., PROPERTIES AND RELIABILITY OF LIQUID EPOXY-RESIN FOR LSI FABRICATION WITH THE PRINTING ENCAPSULATION SYSTEM (PES) (VOL 80, PG 67, 1997), Electronics & communications in Japan. Part 2, Electronics, 80(6), 1997, pp. 67-67
Citations number
1
ISSN journal
8756663X
Volume
80
Issue
6
Year of publication
1997
Pages
67 - 67
Database
ISI
SICI code
8756-663X(1997)80:6<67:PAROLE>2.0.ZU;2-F