OPTIMIZATION OF ACTIVATION AND PROMOTION STEPS FOR DIRECT PLATING ON SUBSTRATES USED FOR SURFACE LAMINAR CIRCUIT

Authors
WANG CT CHIANG YY WANG YY WAN CC
Citation
Ct. Wang et al., OPTIMIZATION OF ACTIVATION AND PROMOTION STEPS FOR DIRECT PLATING ON SUBSTRATES USED FOR SURFACE LAMINAR CIRCUIT, Journal of the Chinese Institute of Chemical Engineers, 28(6), 1997, pp. 463-467
Citations number
10
Journal title
Journal of the Chinese Institute of Chemical Engineers → ACNP
ISSN journal
03681653
Volume
28
Issue
6
Year of publication
1997
Pages
463 - 467
Database
ISI
SICI code
0368-1653(1997)28:6<463:OOAAPS>2.0.ZU;2-L
Abstract
The feasibility of applying direct plating to surface laminar circuit (SLC) system via Pd/Sn catalyst and Na2S promotion has been explored, The substrate to be tested was Probimer-52, It was found the platabili ty is strongly influenced by a combination of the concentration of Pd catalyst and sodium sulfide, An optimal concentration of Na2S was foun d to be 0.5 g/l with an immersion time of 1.5 minutes, The plating rat e was found to reach 1.76 mm/min.