STRESS-RELAXATION BEHAVIOR IN BEADING OF HIGH-STRENGTH COPPER-ALLOYS IN THE CU-NI-SN SYSTEM

Authors
VIRTANEN P TIAINEN T
Citation
P. Virtanen et T. Tiainen, STRESS-RELAXATION BEHAVIOR IN BEADING OF HIGH-STRENGTH COPPER-ALLOYS IN THE CU-NI-SN SYSTEM, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 238(2), 1997, pp. 407-410
Citations number
13
Journal title
Materials science & engineering. A, Structural materials: properties, microstructure and processing → ACNP
ISSN journal
09215093
Volume
238
Issue
2
Year of publication
1997
Pages
407 - 410
Database
ISI
SICI code
0921-5093(1997)238:2<407:SBIBOH>2.0.ZU;2-M
Abstract
The microstructure of spinodally hardened, stress relaxation tested Cu -Ni-Sn alloys is characterized. The main mechanism of relaxation is re crystallization. At 150 degrees C, initial stress values of 480-600 N mm(-2) cause significant microstructural changes even if up to 90% of the initial stress remains after 1000 h of testing. Elevated temperatu re stability depends on the uniformity of deformation. (C) 1997 Elsevi er Science S.A.