ELECTRICAL CROSSTALK ANALYSIS DUE TO BONDWIRE CAPACITIVE INDUCED COUPLING IN OEIC TRANSCEIVER MODULES

Electrical crosstalk calculations due to capacitive induced overcoupli ng from the laser (transmit) to the photodiode (receive) of an OEIC tr ansceiver module are presented in this paper. An efficient method to c alculate the capacitance matrix of an N-bondwires system in the three- dimensional space is first developed. The method is based on an integr al equation approach solved by the Method of Moments. It takes into ac count the actual bondwire shape by using a straight line segment appro ximation. This approach can be applied to a number of arbitrarily shap ed and oriented interconnection bondwires for electrical crosstalk cal culations in such OEIC modules. Finally, the electrical crosstalk due to bondwire coupling in a typical OEIC configuration has been calculat ed by inserting the OEIC equivalent circuit in the SPICE simulation pr ogram.