A novel process for the isolation of AlGaN/GaN HFETs is reported, util
ising co-implantation of phosphorus and He ions. After implantations,
the material sheet resistance is > 10(8) Omega/square, even at tempera
tures as high as 200 degrees C. The high resistance is maintained for
high temperature anneals > 700 degrees C. HFETs fabricated with this p
rocedure exhibit good characteristics.