CONSIDERATION OF THERMAL CONSTRAINTS DURING MULTICHIP-MODULE PLACEMENT

Authors
TANG MC CAROTHERS JD
Citation
Mc. Tang et Jd. Carothers, CONSIDERATION OF THERMAL CONSTRAINTS DURING MULTICHIP-MODULE PLACEMENT, Electronics Letters, 33(12), 1997, pp. 1043-1045
Citations number
4
Categorie Soggetti
Engineering, Eletrical & Electronic
Journal title
Electronics Letters → ACNP
ISSN journal
00135194
Volume
33
Issue
12
Year of publication
1997
Pages
1043 - 1045
Database
ISI
SICI code
0013-5194(1997)33:12<1043:COTCDM>2.0.ZU;2-G
Abstract
A multichip module placement algorithm which handles heat distribution as well as traditional placement objectives is presented. The algorit hm uses a combined quad-partitioning genetic search, and simulated ann ealing technique. Experimental results show improvements in the min-cu t and simulated annealing algorithms, in terms of net length, while sa tisfying the heat distribution constraints.