3-DIMENSIONAL MEMORY MODULE

Demand has recently increased for high packaging density and memory ca pacity of memory modules for electronic equipment, Our new three-dimen sional memory (3-DM) module [1] satisfies this demand, This module has almost the same size as single memory packages [thin small outline pa ckages (TSOPs): 17.4 x 9.22 x 1.2 mm] currently being used, and a pack age density four times as large, Electrical performance is better than that of TSOP's because the length of its wires is about half that of TSOP's wires, Moreover, the cost of fabrication this module is low, Th is paper reports the module's characteristics and fabrication process, The design concept is that nest-generation memory devices will be pro duced by using current mass produced memory devices.