ELECTRICAL DESIGN OF A COST-EFFECTIVE THERMAL ENHANCED PLASTIC BALL GRID ARRAY PACKAGE - NUBGA

An electrically and thermally optimized plastic ball grid array (PBGA) package, called nem and useful ball grid array (NuBGA) is presented, NuBGA is a cavity down package with a metal heat spreader covering the entire back-side of the chip, The heat spreader is laminated with a s ingle-core double-sided organic substrate. Super electrical performanc e is achieved by using the split-wrap-around (SWA) or split-via-connec tion (SVC) design concepts, All traces on the core substrate are desig ned into mu-stripline and co-planar stripline structures, In this pape r, the focus is on 1) the unique design concepts; 2) the electrical me asurement; 3) the electrical analysis; 4) the electrical performance c omparison with other standard packages.