Gr. Bai et al., LOW-TEMPERATURE GROWTH AND ORIENTATIONAL CONTROL IN RUO2 THIN-FILMS BY METAL-ORGANIC CHEMICAL-VAPOR-DEPOSITION, Thin solid films, 310(1-2), 1997, pp. 75-80
For growth temperatures in the range of 275 degrees C to 425 degrees C
, highly conductive RuO2 thin films with either (110)- or (101)-textur
ed orientations have been grown by metal-organic chemical vapor deposi
tion (MOCVD) on both SiO2/Si(001) and Pt/Ti/SiO2/Si(001) substrates. B
oth the growth temperature and growth rate were used to control the ty
pe and degree of orientational texture of the RuO2 films. In the upper
part of this growth temperature range (similar to 350 degrees C) and
at a low growth rate (< 3.0 nm/min.), the RuO2 films favored a (110)-t
extured orientation. In contrast, at the lower part of this growth tem
perature range (similar to 300 degrees C) and at a high growth rate (>
3.0 nm/min.), the RuO, films favored a (101)-textured orientation. In
contrast, higher growth temperatures (> 425 degrees C) always produce
d randomly-oriented polycrystalline films. For either of these low-tem
perature growth processes, the films produced were crack-free, well-ad
hered to the substrates, and had smooth, specular surfaces. Atomic for
ce microscopy showed that the films had a dense microstructure with an
average grain size of 50-80 nm and a rms. surface roughness of simila
r to 3-10 nm. Four-probe electrical transport measurements showed that
the films were highly conductive with resistivities of 34-40 mu Omega
-cm (at 25 degrees C). Published by Elsevier Science S.A.