J. Yuhara et K. Morita, THERMAL-REACTION PROCESSES OF TERNARY METAL (AU, AG, CU) ADSORBATES ON THE SI(111) SURFACE, Applied surface science, 123, 1998, pp. 56-60
Citations number
19
Categorie Soggetti
Physics, Applied","Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
The change of atomic structures and compositional ratios by thermal an
nealing of ternary metal (Au, Cu, Ag) adsorbates on the Si(111) surfac
e has been studied by means of LEED-AES-RBS techniques. The Ag adsorba
te on the Si(111)-root 3 X root 3-(Au, Cu) surface produces a clear 2
root 3 X 2 root 3 LEED pattern on annealing at 300 degrees C. The cove
rages for the 2 root 3 X 2 root 3 pattern are in the region of 0.4-0.6
ML for Au, 0.3-0.6 ML for Ag and 0.05-0.25 ML for Cu. The Au atoms ar
e thermally the most stable among the ternary metal adsorbates on the
Si(111) surface. When the Cu coverage decreases to 0 ML on isochronal
annealing, the 2 root 3 X 2 root 3 pattern changes into the root 3 X r
oot 3 pattern, which is assigned to the root 3 X root 3-(Au, Ag) struc
ture. When the sum of Ag and Cu coverages is less than 1 ML, the Si(11
1)-(Ag, Cu) surface shows a mix of root 3 X root 3 and '' 5 X 5 ''. Th
e Si(111)-(Au, Cu) surface shows only a root 3 X root 3 pattern. These
results indicate that the Si(111)-2 root 3 X 2 root 3-(Au, Ag, Cu) st
ructure is a ternary alloy phase. Since Ag and Cu on the Si(111) surfa
ce hardly mix with each other, Au plays an important role in formation
of the two-dimensional ternary alloy on the Si(111) surface. (C) 1998
Elsevier Science B.V.