DIE-CAVITY POCKETING VIA CUTTING SIMULATION

For die-cavity pocketing, the cavity volume is sliced into a number of cutting-layers by horizontal cutting-planes, and each layer is pocket -machined using the contour-parallel offset method in which the tool-p aths are obtained by repeatedly offsetting the boundary-pocketing curv e. The major challenges in die-cavity pocketing include: 1) finding a method for obtaining the boundary-pocketing curve, 2) generating evenl y spaced contour-parallel offset tool-paths, 3) detecting and removing uncut-regions, and 4) estimating chip-loads for an adaptive feed cont rol. No systematic solution for these problems has been offered in the literature, except the curve offsetting methods for computing contour -parallel offset curves. Presented in the article is a straightforward approach to die-cavity pocketing, in which all the four challenges ar e handled successfully by using the existing cutting-simulation method s. (C) 1997 Elsevier Science Ltd. All rights reserved.